Bandai High Grade 1/144 Scale Model Kit

Release Date: September 4th, 2009

The protagonist of the PS3 software "Mobile Suit Gundam Senki", "Full Armor Gundam Unit 7", is already three-dimensionalized with HGUC! Precisely reproduces from the complicated surface composition of the exterior to the precise mold. 

The head is integrally molded with no seams by slide molding. 

Double joints are used for the elbows and knees, and a front-back swing mechanism is used for the hip joints. 

Various action scenes can be reproduced with outstanding proportions and a wide range of motion. 

The tail binder is movable independently